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Solder Bar
SOLDER BAR
Tin Bar
PRODUCT SELECTION
DETAILED INTRODUCTION

Product Features & Advantages

·  High reliability, low voidage

·  Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc. Suitable for all kinds of lead-free circuit board surface coating, including: OSP, HASL, ENIG.

·  Excellent printability and printing life: stable and consistent printing performance of more than 12 hours, printing speed up to 150mm/s, short printing cycle, high output.

·  Wide reflux temperature curve process window: In air and nitrogen environments, good welding results can be achieved for complex high-density PWB components.

·  Excellent appearance of solder joints and residues after reflow soldering.

Product Application

Printed circuit board (PCB) assembly, including smartphones, tablets, computer motherboards, consumer electronics, web servers, automotive electronic systems, medical, military and aerospace equipment.

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